We buy used wafer processing, test, wire bonding, and dicing equipment from fabs worldwide. 24-hour valuation, fast payment, complete logistics handling.
All major brands and types of semiconductor manufacturing equipment. Single units or entire fab lines.
Disco dicing saws, wafer saws, and grinding systems for wafer singulation.
View all →Fast, fair, and fully managed — we handle everything so you can focus on your fab.
Send us your equipment list and receive a preliminary offer within 24 hours, backed by real-time secondary market data.
We buy directly from you. One contract, one payment, zero ambiguity. Not a broker — we take ownership.
Your sale stays confidential. Standard NDAs available. Counterparties never contact you directly.
We handle dismantling, crating, freight, and customs — worldwide. Your facility is back in service quickly.
We use real-time market data and active demand to ensure you receive competitive, transparent pricing.
Active across the US, Europe, Taiwan, Korea, Japan, Singapore, and Southeast Asia. Any location, any scale.
Simple, fast, and risk-free from start to finish.
Send us your equipment list with model numbers, configuration, and photos.
We respond within 24 hours with a competitive offer based on current market data.
We handle removal, logistics, and export. Payment wired on agreed terms.
Get a free, no-obligation valuation within 24 hours. Single unit or entire fab.
Get Your Free Valuation →
