CLUSTER A

Test Equipment

ATE test systems, test handlers, wafer probers, and probe cards from all major OEMs.

Advantest
Advantest T5501 Test System

Advantest T5501

Semiconductor test system for memory and SoC testing. High-throughput test handler with proven reliability.

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Advantest
Advantest T5501 Test Equipment

Advantest T5501 (Alt View)

Alternative configuration view of the T5501 test platform.

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Other Brands
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Other Test Equipment

V93000, T2000, MPT, and other test platforms from Advantest, Teradyne, and others.

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CLUSTER B

Wire Bonders & Die Bonders

Established wire bonders and die attach equipment from Shinkawa, ASM, KS, and other leading manufacturers.

Shinkawa (日本新川)

Shinkawa
Shinkawa UTC-3000 Wire Bonder

Shinkawa UTC-3000

High-speed wire bonder for semiconductor packaging. Reliable performance for high-volume production.

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Shinkawa
Shinkawa UTC-5000 Wire Bonder

Shinkawa UTC-5000

Advanced wire bonder with improved speed and accuracy for fine-pitch bonding applications.

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ASM

ASM
ASM AERO C20 Wire Bonder

ASM AERO C20

Premium wire bonder for advanced packaging. High accuracy and excellent yield performance.

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ASM
ASM GOCU Wire Bonder

ASM GOCU

Reliable die bonder and wire bonder platform for medium to high-volume assembly.

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KS (Kulicke & Soffa)

KS
KS ICONN Wire Bonder

KS ICONN

Advanced wire bonder with intelligent control for high-speed, high-accuracy bonding.

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KS
KS ICONN LED Wire Bonder

KS ICONN LED

Specialized wire bonder optimized for LED and optoelectronic device packaging.

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KS
KS ICONN PLUS Wire Bonder

KS ICONN PLUS

Enhanced version with improved bond force control and throughput for volume production.

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KS
KS ULTRA Wire Bonder

KS ULTRA

High-performance wire bonder for demanding packaging applications with superior accuracy.

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CLUSTER C

Dicing & Sawing Equipment

Precision dicing saws, wafer saws, and grinding systems from Disco and other leading manufacturers.

Disco
Disco DFD6361 Dicing Saw

Disco DFD6361

Precision dicing saw for wafer singulation. Excellent for semiconductor and electronics manufacturing.

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Disco
Disco DFG8560 Wafer Grinder

Disco DFG8560

Wafer grinding system for backside thinning. High precision and surface quality.

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Disco
Disco DFL7160 Dicing Saw

Disco DFL7160

High-speed dicing saw with excellent accuracy for high-volume production environments.

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We buy all types of semiconductor equipment. Contact us with your equipment list and we'll respond within 24 hours.

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