All major brands across the full semiconductor manufacturing process flow. Single units or entire fab lines — we acquire globally.
ATE test systems, test handlers, wafer probers, and probe cards from all major OEMs.
Semiconductor test system for memory and SoC testing. High-throughput test handler with proven reliability.
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Alternative configuration view of the T5501 test platform.
Request Quote →V93000, T2000, MPT, and other test platforms from Advantest, Teradyne, and others.
Request Quote →Established wire bonders and die attach equipment from Shinkawa, ASM, KS, and other leading manufacturers.
High-speed wire bonder for semiconductor packaging. Reliable performance for high-volume production.
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Advanced wire bonder with improved speed and accuracy for fine-pitch bonding applications.
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Premium wire bonder for advanced packaging. High accuracy and excellent yield performance.
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Reliable die bonder and wire bonder platform for medium to high-volume assembly.
Request Quote →Advanced wire bonder with intelligent control for high-speed, high-accuracy bonding.
Request Quote →Specialized wire bonder optimized for LED and optoelectronic device packaging.
Request Quote →Enhanced version with improved bond force control and throughput for volume production.
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High-performance wire bonder for demanding packaging applications with superior accuracy.
Request Quote →Precision dicing saws, wafer saws, and grinding systems from Disco and other leading manufacturers.
Precision dicing saw for wafer singulation. Excellent for semiconductor and electronics manufacturing.
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Wafer grinding system for backside thinning. High precision and surface quality.
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High-speed dicing saw with excellent accuracy for high-volume production environments.
Request Quote →We buy all types of semiconductor equipment. Contact us with your equipment list and we'll respond within 24 hours.
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